Probe Card

Mission

To develop a CORAD vertical probe card system with better performance than similar types of vertical probe cards in the market, with a significant cost benefit and fast delivery.

Strategy

Probe card with better specifications than competitors

Offer low per probe price to the market

Offer competitive price on the interface: multi-site MLO carrier and low assembly cost

Fast delivery by automating the manufacturing process

Probe Head Technology

Probe Technology: A proven technology -- vertical bucking beam

Probe Advantages:
>> The contact force is linear after certain over drive
>> Able to achieve small pitch with incremental increase in cost
>> Single probe replacement on site

Drilling technology: Laser drill

Drilling Advantages:
>> Capable of drilling very small holes
>> Lower drill cost than mechanical drill
>> Flexible manufacturing

Corad have developed the following automatic machines to form the probes:

Wire cutting, probe length measurement and insertion into plating fixture

Plating line to form the space transformer end of the probe

Probe tip and tail grinding machine to control length

QA machine to measure straightness of probe and to measure the probe diameter and input results into QA database

Building the Probe Head:

NC machine and lapping machine to form the parts of the probe head

Laser machine to drill the holes in the ceramic guide plates

Automatic machine to insert probes into ceramic guide plates (240 probes per hour)

Developed MLO/MLC vapor soldering process

Final lapping machine to grind the probe tips after assembling the probe card (for planarity control)

Measure X, Y, Z position of the probe tips

Developed leakage current measurement tool

Preliminary Probe Specifications

Flip Chip
ProbeMaterial Alignment Planarity Tip Length Needle Diameter Tip Diameter Probe Length Probe Force Minimum Pitch Recommended OD Max OD Temperature Range Current Capacity Contact Resistance
Paliney C +/-10u <= 10u 350u 50u 50u 7.25mm 5g/OD 75u 120u Last + 30u 100u -40 to 150C 700mA 0.3Ohm
Paliney C +/-10u <= 10u 350u 50u 50u 10mm 3g/OD 75u 120u Last + 30u 100u -40 to 150C 700mA 0.3Ohm
CuAg +/-10u <= 10u 350u 50u 50u 7mm 5g/OD 75u 120u Last + 30u 100u -40 to 150C 800mA 0.3Ohm
CuAg +/-10u <= 10u 450u 64u 64u 10mm 7g/OD 75u 150u Last + 30u 100u -40 to 150C 975mA 0.3Ohm
BondPad
ProbeMaterial Alignment Planarity Tip Length Needle Diameter Tip Diameter Probe Length Probe Force Minimum Pitch Recommended OD Max OD Temperature Range Current Capacity Contact Resistance
CuAg +/-10u <= 12.5u 400u 25u 10u 4.75mm 3g/OD 75u 60u Last + 30u 75u -40 to 150C 400mA 0.3Ohm
Paliney C +/-10u <= 10u 350u 50u 10u 10mm 3g/OD 75u 120u Last + 30u 75u -40 to 150C 700mA 0.3Ohm
WaferLevel
ProbeMaterial Alignment Planarity Tip Length Needle Diameter Tip Diameter Probe Length Probe Force Minimum Pitch Recommended OD Max OD Temperature Range Current Capacity Contact Resistance
PdAlloy +/-20u <= 25u 400u 107u 95u 3.3mm 8.1g/OD 200u 200u ≤200u 200u -40 to 150C 1300mA 0.3Ohm
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